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www.rohm.com tsz02201 - 0glg0g200740 -1-2 ? 2015 rohm co., ltd. all rights reserved. 1/ 22 11.jul.2016 rev.003 tsz22111 ? 14 ? 001 input/output full swing low supply current cmos op erational amp lifier for automotive bu7241yg -c general description bu72 41yg-c is a low - voltage input/outpu t full - swing cmos operational amplifier that operates on a wide temperature range and low supply current. it is suitable for a sensor amplifier and b attery - powered e quipment which require low input bias current . features ? aec- q100 qualified (note 1) ? input/output full swing ? low operating supply voltage ? low supply current ? low input bias current ? wide operating temperature range (note 1 : grade 1) application s ? sensor a mplifier s ? battery- powered equipment ? automotive electronics pin con figuration pin description key specification s ? operating s upply v oltage range : single supply 1.8v to 5.5v split supply 0.9v to 2.75v ? operating temperature range: - 40c to +125c ? supply current: 70a (typ) ? input offse t current: 1pa (typ) ? input bias current: 1pa (typ) special characteristics ? input offset voltage - 40c to + 125 c: 12mv (max) package w(typ) x d(typ) x h(max) ssop5 2.90mm x 2.80mm x 1.25mm pin no. pin name function 1 in + non - inverting input 2 vss ground/negative power supply 3 in - inverting input 4 out output 5 vdd positive power supply ssop5 product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays. (top view) vss vdd out in - in+ 1 - + 2 3 4 5 datashee t
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 2 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c block diagra m absolute maximum rating s (t a =25 c ) parameter symbol rating unit supply voltage vdd-vss 7 v power d issipation p d 0. 67 (note 2 , 3 ) w differential input voltage (note 4 ) v id vdd - vss v input common - mode voltage range v icm (vss - 0.3) to (vdd + 0.3) v input current (note 5 ) i i 10 ma operating supply voltage v opr 1.8 to 5.5 0.9 to 2.75 v operating temperature t opr - 40 to + 125 c storage temperature t stg -55 to + 150 c maximum junction temperature t jmax 150 c (note 2 ) to use at temperature above t a = 25 c reduce 5.4 mw / c . (note 3 ) mounted on a n fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil area less than 3%). (note 4 ) the voltage difference between inverting input and non - inverting input is the differential input voltage the input pin voltage is set to more th a n v ss. (note 5 ) an excessive i nput current will flow when input voltages of more than v dd +0.6v or less than v ss- 0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit prote ction measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. in+ out in - vdd vss v bias class ab control v bias figure 1 . block diagram
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 3 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c electrical c haracteristics (unless otherwise specified vdd=3v, vss=0v, t a =25c) ( note 6 ) absolute value ( note 7 ) full range: t a = - 40 c to +1 2 5 c ( note 8 ) consider the power dissipation of the ic under high temperature environment when selecting the output current value. there may be a case where the output current value is reduced due to the rise in ic temperature caused by the heat generated inside the ic. parameter symbol temperature range limit unit conditions min typ max input offset voltage ( note 6 , 7 ) v io 25c - 1 10 mv vdd =1.8 v to 5.5v full range - - 1 2 input offset current ( note 6 ) i io 25c - 1 - pa - input bias current ( note 6 , 7 ) i b 25c - 1 300 pa - full range - - 6 000 supply current ( note 7 ) i dd 25c - 70 150 a r l = , a v =0db, in+ =1.5v full range - - 250 maximum output voltage ( high ) ( note 7 ) v oh 25c vdd-0. 0 5 - - v r l =10k full range vdd-0. 1 - - maximum output voltage(low) ( note 7 ) v ol 25c - - v ss+ 0. 0 5 v r l =10k full range - - vss +0. 1 large signal voltage gain ( note 7 ) a v 25c 70 100 - db r l =10k full range 65 - - input common - mode voltage range v icm 25c 0 - 3 v - common - mode rejection ratio cmrr 25c 45 70 - db - power supply rejection ratio psrr 25c 60 80 - db - output source current (note 7, 8 ) i source 25c 4 10 - ma out =v dd- 0.4v full range 2 - - output sink current (note 7, 8 ) i sink 25c 5 15 - ma out =v ss +0.4v full range 3 - - slew rate sr 25c - 0.4 - v/s c l =25pf gain bandwidth product gbw 25c - 1 - mhz c l =25pf, a v =40db phase margin 25c - 50 - deg c l =25pf, a v =40db total harmonic distortion + noise thd+n 25c - 0.05 - % out = 0.8 v p - p , f=1khz
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 4 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c description of electrical characteristics described below are descriptions of the relevant electrical terms used in this datasheet . items and symbols used are also shown. note that item name and symbol and their meaning may differ from those on another manufacturer?s do cument or general document. 1. absolute m aximum r atings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environme nt may cause deterioration of characteristics. 1.1 supply voltage (vdd/v ss) indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. 1.2 differential input voltage (v id ) indicates the maximum voltage that can be applied between non - inverting and inverting terminals without damaging the ic. 1.3 input common - mode voltage range (v icm ) indicates the maxi mum voltage that can be applied to the non - inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common - mode voltage range of the maximum ratings does not assure normal operation of ic. for normal opera tion, use the ic within the input common - mode voltage range characteristics. 1. 4 power dissipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient temperature 25 c (normal temperature). as for package product, p d is determined by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical c haracteristics 2.1 input o ffset v oltage (v io ) indicates the voltage difference between non - inverting terminal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. 2. 2 input o ffset c urrent (i io ) indicates the difference of input bias current between the non - inverting and inverting terminals. 2. 3 inp ut b ias c urrent (i b ) indicates the current that flows into or out of the input terminal. it is defined by th e average of input bias currents at the non- inverting and inverting terminals. 2. 4 suppl y c urrent (i dd ) indicates the current that flows within the ic under specified no - load conditions. 2. 5 maximum o utput v oltage (high) / maximum o utput v oltage (low) (v oh /v ol ) indicates the voltage range of the output under specified load condition. it is typically divided into maximum o utput v oltage h igh and low. maximum output voltage high indicates the upper limit of output voltage. maximum output voltage low indicates the lower limit. 2. 6 large s ig nal v olta ge g ain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non - inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. a v = (output voltage) / (differential input voltage) 2. 7 input c ommon - mode v oltage r ange (v icm ) indicates the input voltage rang e where ic normally operates. 2. 8 common - mode r ejection r atio (cmrr) indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common - mode volta ge)/(input offset fluctuation) 2. 9 power s upply r ejection r atio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply voltage)/(input offset f luctuation) 2.1 0 output s ource c urrent/ o utput s ink c urrent (i source / i sink ) the maximum current that can be output from the ic under specific output conditions. the output source current indicates the current flowing out from the ic, and the output sink current indicates the current flowing into the ic. 2.1 1 slew r ate (sr) in dicates the ratio of the change in output voltage with time when a step input signal is applied. 2.1 2 gain band width ( gbw ) the product of the open - loop voltage gain and the frequency at which the voltage gain decreases 6db/octave. 2.1 3 phase margin () indicates the margin of phase from 180 degree phase lag at unity gain frequency . 2.1 4 total h armonic d istortion + noise (thd +n) indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel.
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 5 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c typical performance curves (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 50 100 150 200 250 -50 -25 0 25 50 75 100 125 supply current [ a] ambient temperature [ c] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 150 power dissipation [w] ambient temperature [ c] 0 50 100 150 200 250 1 2 3 4 5 6 supply current [ a] supply voltage [v] 0 1 2 3 4 5 6 1 2 3 4 5 6 maximum output voltage (high) [v] supply voltage [v] figure 5. maximum output voltage (high) vs supply voltage (r l =10k) - 40c 25c 125c figure 3. supply current vs supply voltage figure 4.supply current vs ambient temperature figure 2 . power dissipation vs ambient temperature ( derating c urve ) - 40 c 25 c 125 c 1.8v 5.5v 3.0v
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 6 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c typical performance curves - continued (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 2 4 6 8 10 0.0 0.3 0.6 0.9 1.2 1.5 1.8 output source current [ma] output voltage [v] 0 5 10 15 20 -50 -25 0 25 50 75 100 125 maximum output voltage (low) [mv] ambient temperature [ c] 0 5 10 15 20 1 2 3 4 5 6 maximum output voltage (low) [mv] supply voltage [v] 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 maximum output voltage (high) [v] ambient temperature [ c] figure 6. maximum output voltage (high) vs ambient temperature (r l =10k) figure 7. maximum output voltage (low) vs supply voltage (r l =10k) figure 8. maximum output voltage (low) vs ambient temperature (r l =10k) 1.8v 5.5v 3.0v 1.8v 5.5v 3.0v - 40c 25c 125c figure 9. output source current vs output voltage (vdd =1.8v) - 40c 25c 125c
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 7 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c typical performance curves - continued (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 4 8 12 16 20 0 0.3 0.6 0.9 1.2 1.5 1.8 output sink current [ma] output voltage [v] 0 4 8 12 16 20 -50 -25 0 25 50 75 100 125 output source current [ma] ambient temperature [ c] 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output source current [ma] output voltage [v] 0 10 20 30 40 50 60 70 80 0 1 2 3 4 5 6 output source current [ma] output voltage [v] figure 10 . output source current vs output voltage (vdd=3 .0 v) - 40c 25c 125c figure 1 1. output source current vs output voltage (vdd =5.5v) - 40c 25c 125c figure 1 2. output source current vs ambient temperature ( out =v dd- 0.4v) 1.8v 5.5v 3.0v figure 1 3. output sink current vs output voltage (vdd =1.8v) - 40c 25c 125c
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 8 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c typical performance curves - continued (*)the above characteristics are measurements of typical sample, they are not guaranteed. -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 1 2 3 4 5 6 input offset voltage [mv] supply voltage [v] 0 10 20 30 40 -50 -25 0 25 50 75 100 125 output sink current [ma] ambient temperature [ c] 0 8 16 24 32 40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output sink current [ma] output voltage [v] 0 20 40 60 80 100 0 1 2 3 4 5 6 output sink current [ma] output voltage [v] figure 1 5. output sink current vs output voltage (vdd =5.5v) figure 1 6. output sink current vs ambient temperature ( out =v ss +0.4v) - 40c 25c 125c 5.5v 1.8v 3.0v figure 1 7 . input offset voltage vs supply voltage (v icm =v dd , e k = - v dd /2 ) - 40c 25c 125c figure 1 4. output sink current vs output voltage (vdd=3 .0 v) - 40c 25c 125c
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 9 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c typical performance curves - continued (*)the above characteristics are measurements of typical sample, they are not guaranteed. -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 input offset voltage [mv] ambient temperature [ c] figure 1 9. input offset voltage vs input voltage (vdd =1.8v) figure 1 8 . input offset voltage vs ambient temperature (v icm =v dd, e k = -vdd/2 ) 5.5v 1.8v 3.0v -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 input offset voltage [mv] input voltage [v] - 40c 25c 125c figure 20. input offset voltage vs input voltage (vdd=3 .0 v) -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 input offset voltage [mv] input voltage [v] - 40c 25c 125c figure 21. input offset voltage vs input voltage (vdd =5.5v) -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 5 6 7 input offset voltage [mv] input voltage [v] - 40c 25c 125c
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 10/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c typical performance curves - continued (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 common - mode rejection ratio [db] ambient temperature [ c] 0 20 40 60 80 100 120 1 2 3 4 5 6 common - mode rejection ratio [db] supply voltage [v] 0 40 80 120 160 -50 -25 0 25 50 75 100 125 large signal voltage gain [db] ambient temperature [ c] 0 40 80 120 160 1 2 3 4 5 6 large signal voltage gain [db] supply voltage [v] figure 23 . large signal voltage gain vs ambient temperature figure 24 . common - mode rejection ratio vs supply voltage figure 2 5 . common - mode rejection ratio vs ambient temperature - 40c 25c 125c 5.5v 1.8v 3.0v figure 22 . large signal voltage gain vs supply voltage - 40c 25c 125c 5.5v 1.8v 3.0v
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 11 / 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c typical performance curves - continued (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 slew rate h -l [ v/s] ambient temperature [ c] 0 20 40 60 80 100 120 140 -50 -25 0 25 50 75 100 125 power supply rejection ratio [db] ambient temperature [ c] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 slew rate l -h [ v/s] ambient temperature [ c] 0 40 80 120 160 200 0 20 40 60 80 100 1.e+02 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 phase [deg] voltage gain [db] frequency [hz] figure 2 6 . power supply rejection ratio vs ambient temperature figure 2 7 . slew rate l - h vs ambient temperature figure 2 8 . slew rate h - l vs ambient temperature figure 2 9 . voltage gain ? phase vs frequency (v dd =3 .0 v) 5.5v 1.8v 3.0v 5.5v 1.8v 3.0v phase gain 10 2 10 3 10 4 1 0 5 10 6 10 7
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 12/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c application information null method condition for test c ircuit 1 vdd, vss, e k , v icm , v rl unit:v parameter v f s1 s2 s3 vdd vss e k v icm v rl calculation input o ffset v oltage v f1 on on off 3 0 - 1.5 3 - 1 large s ignal v oltage g ain v f2 on on on 3 0 - 0.5 1.5 1.5 2 v f3 - 2.5 common - mode r ejection r atio (input c ommon - mode v oltage r ange) v f4 on on off 3 0 - 1.5 0 - 3 v f5 3 power s upply r ejec t ion r atio v f6 on on off 1.8 0 - 0.9 0 - 4 v f7 5.5 - 2.75 - calculation - 1. input o ffset voltage (v io ) 2. large s ignal v oltage g ain (a v ) 3. common - mode r ejection r atio (cmrr) 4. power s upply r ejection r atio (psrr) figure 30 . test circuit 1 v icm r s =50 r s =50 r f =5 0k r i = 1m r i = 1m 0.015f 0.015f sw1 sw2 50k sw3 r l v rl 0.1f e k 50 0k 50 0k 1000pf v f 0. 0 1f 15v - 15v v dd v ss v out v null dut v io |v f1 | = 1+r f /r s [v] av |v f2 - v f3 | = e
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 13/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c application information - continued switch condition for test c ircuit 2 parameter sw1 sw2 sw3 sw4 sw5 sw6 sw7 sw8 sw9 sw10 sw 11 sw12 supply c urrent off off on off on off off off off off off off m aximum o utput v oltage (r l =10k ) off on off off on off off on off off on off o utput c urrent off on off off on off off off off on off off slew r ate off off on off off off on off on off off o n gain bandwidth product on off off on on off off off on off off on figure 31 . test circuit 2 figure 32 . slew rate input and output wave input voltage output voltage input wave output wave t 3 v p - p 3 v 0 v sw1 sw2 >+ >) sw9 sw10 sw11 sw8 sw5 sw6 sw7 c l sw12 sw4 r1 =1k r2=100k r l v ss v dd v out v in - v in+ v rl
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 14/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c application information ? continued 1. unused c ircuits when there are unused op - amps, it is recommended that they are connected as in figure 3 3 , setting the non- inverting input terminal to a potential within the input common - mode voltage range (v icm ). 2. i nput voltage applying v ss- 0.3v to v dd +0.3v to the input terminal is possible without causing deterioration of the electrical characteristics or destruction. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 3. power supply (s ingle/d ual) the operat ional amp lifier operates when the voltage supplied is between vdd and vss. therefore, the single supply operat ional amp lifiers can be used as dual supply operat ional amp lifiers as well. 4. latch u p be careful of input voltage that exceed the v dd and v ss . when cmos device have sometimes occur latch up a nd protect the ic from abnormaly noise. 5. dec o upling c apacitor insert the dec o upling capacitance between vdd and vss , for stable operation of operational amplifier. 6. start - up the supply voltage this ic has esd protection diode between input and v dd,v ss terminals. when apply the voltage to input terminal before start up the supply voltage then the current flow into or out from input terminal via v dd or v ss terminal. the current is depending on applied voltage. this phenomena causes breakdown the ic or malfunction. theref ore, give a special consideration to input terminal protection and start up order of supply voltage. 7. output capacitor if a large capacitor is connected between the output pin and vss pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the v dd pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 0. 1uf between output pin and vss pin . figure 3 3 . example of a pplication c ircuit for u nused o p - amp keep this potential in v icm v dd v ss v icm
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 15/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c application information ? continued 8. oscillation by output capacitor please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ics. when the amplifier is used with a full feedback loop , a c apacitive load must be up to 100pf b ecause there is a risk of oscillation . the following figure shows the frequency characteristics for each load capacitance. -20 -10 0 10 20 voltage gain [db] frequency [hz] figure 35. voltage gain vs frequency (v dd =3 .0 v , gv=0db ) 10 3 10 4 1 0 5 10 6 10 7 150pf 100pf 5pf 0 10 20 30 40 50 voltage gain [db] frequency [hz] figure 34. voltage gain vs frequency (v dd =3 .0 v , gv=40db ) 10 3 10 4 1 0 5 10 6 10 7 150pf 100pf 5pf figure 37. phase margin vs load capacitance (v dd =3 .0 v , gv=0db ) 10 ,
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 16/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c application information ? continued 8 . oscillation by output capacitor the following figure shows an improved circuit example of the frequency characteristics due to the output capacitor. -20 -10 0 10 20 voltage gain [db] frequency [hz] figure 39. i mprovement circuit example 2 figure 38. i mprovement circuit example 1 -20 -10 0 10 20 voltage gain [db] frequency [hz] figure 41 . voltage gain vs frequency (v dd =3 .0 v ,gv=0db, cl=100pf ,circuit:figure39 ) 10 3 10 4 1 0 5 10 6 10 7 rl=0
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 17/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c example s of c ircuit voltage f ollower inverting a mplifier non - inverting a mplifier figure 4 3 . inverting amplifier c ircuit figure 44 . non - inverting a mplifier c ircuit figure 42 . voltage f ollower c ircuit voltage gain is 0db. using this circuit, the output voltage ( out ) is configured to be equal to the input voltage ( in ). this circuit also stabilizes the output voltage ( out ) due to high input impedance and low output impedance. computation for output voltage ( out ) is shown below. out=in for inverting amplifier, input voltage ( in ) is amplified by a voltage gain and depends on the ratio of r1 and r2 . the out -of - phase output voltage is shown in the next expression out = - (r2/r1) ? in this circuit has i nput impedance equal to r1. for non - inverting amplifier, input voltage ( in ) is amplified by a voltage gain, which depends on the ratio of r1 and r2. the output voltage ( out ) is in - phase with the input voltage ( in ) and is shown in the next expression. out =(1 + r2/r1) ? in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. vss out in vdd r 2 r 1 vss in out vdd vss r 2 vdd in out r 1
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 18/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing proc ess, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). maximum junction temperature is typically eq ual to the maximum storage temperature. the heat generated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbo l ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 45 (a) shows the model of the thermal resistance of a package. the equation below shows how to compu te for the thermal resistance ( ja ), given the ambient temperature ( t a ), maximum junction temperature ( t jmax ), and power dissipation (p d ). ja = ( t jmax t a ) / p d c/w the d erating curve in figure 45 (b) indicates the power that the ic can consum e with reference to ambient temperature. power consumption of the ic begins to attenuate at certain temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, package, ambient temperature, pack age condition, wind velocity, etc. this may al so vary even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 45( c ) shows an example of the derating curve for bu7241yg -c. (note 9 ) unit 5.4 mw/ c when using the unit above t a =25 c, subtract the value above per celsius degree. power dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (cop per foil area less than 3%) is mounted 0.0 0.2 0.4 0.6 0.8 0 50 100 150 power dissipation [w] ambient temperature [ c] ( c )bu7241 yg - c (note 9 ) 12 5 figure 45 . thermal resistance and derating curve
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 19/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines d esign the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, con nect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large- current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the p d stated in this specification is whe n the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a ra nge within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the int ernal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring , width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connectin g or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direct ion and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter - pin shorts could be due to many reasons s uch as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transi stor and cause un expected operation of the ic. u nless otherwise specified, unused input pins should be connected to the power supply or ground line.
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 20/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c operational notes ? continued 12. regarding the input pin of the ic in the construction of this ic, p - n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasi tic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pin s when no power supply voltage is applied to the ic. even if the power supply voltage i s applied, make sure that the input pin s have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others.
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 21/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c p hysical dimension , tape and reel information package name ssop5
datasheet www.rohm.com tsz02201 - 0glg0g200740 - 1 - 2 ? 2015 rohm co., ltd. all rights reserved. 22/ 22 11.jul.2016 rev.003 tsz22111 ? 15 ? 001 bu7241yg - c ordering information b u 7 2 4 1 y g - c tr part number bu7241y g package g : ssop5 product rank c: automotive packaging and forming specification tr: embossed tape and reel line - up t opr channels package orderable part number - 40c to +125c 1ch ssop5 reel of 3000 bu7241yg - c tr marking diagram rev ision history date revision changes 17. mar .201 5 001 new release 09. mar .201 6 002 application information : addition and move some from operational notes absolute maximum rating s : addition ( split supply ) 11.jul .2016 003 addition : page 3 note7(i b ,v oh ,v ol ,a v ,i source ,i sink ) correction : page 14 figure 37 ? 33 correction : page 18 figure 36 ? 45 deletion : page 22 ? land p attern ? d ata product name package type marking bu7241 y g ssop5 xq part number marking ssop5 (top view) lot number
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
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